ADF4107 Datasheet, PDF (20/20 Pages) Analog Devices – PLL Frequency Synthesizer

ADF4107
OUTLINE DIMENSIONS
5.10
5.00
4.90
16
9
4.50
4.40
4.30
1
6.40
BSC
8
PIN 1
0.15
0.05
0.65
BSC
1.20
MAX
0 .2 0
0 .0 9
0.30
8°
0 .1 9 _SEATING
0°
COPLANARITY
PLANE
0.10
COMPLIANT TO JEDEC STANDARDS MO-1 5 3 AB
0.75
0.60
0.45
Figure 30. 16-Lead Thin Shrink Small Outline Package [TSSOP] (RU-16)—Dimensions shown in millimeters
4.0
BSC SQ
PIN 1
INDICATOR
TOP
VIEW
3.75
BSC SQ
12 ° MAX
1.00
0.90
0.80
SEATING
PLANE
0.50
BSC
1.00 MAX
0.65 NOM
0.05
0.02
0.00
0.20
REF
0.60
MAX
0.60
MAX
16
20
15
1
BOTTOM
VIEW
0.75
0.55
0.35
11
5
10
6
0.30
0.23
0.18
COPLANARITY
0.08
2.25
2.10 SQ
1.95
COMPLIANT TO JEDEC STANDARDS MO-220-VGGD-1
Figure 31. 20-Lead Frame Chip Scale Package [LFCSP] (CP-20)—Dimensions shown in millimeters
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the
human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
ORDERING GUIDE
Model
Temperature Range
ADF4107BRU
–40°C to + 85°C
ADF4107BRU–REEL
–40°C to + 85°C
ADF4107BRU–REEL7
–40°C to + 85°C
ADF4107BCP
–40°C to + 85°C
ADF4107BCP–REEL
–40°C to + 85°C
ADF4107BCP–REEL7
–40°C to + 85°C
RU = Thin Shrink Small Outline Package (TSSOP)
CP = Chip Scale Package
Contact the factory for chip availability.
Note that aluminum bond wire should not be used with the ADF4107 die.
© 2003 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective companies.
C03338-0-5/03(0)
Rev. 0 | Page 20 of 20
Package Option
RU-16
RU-16
RU-16
CP-20
CP-20
CP-20