ADA4841-1_17 Datasheet, PDF (20/20 Pages) Analog Devices – Low Power, Low Noise and Distortion Rail-to-Rail Output Amplifiers

ADA4841-1/ADA4841-2
PIN 1 INDEX
AREA
0.80
0.75
0.70
SEATING
PLANE
3.10
3.00 SQ
2.90
2.44
2.34
2.24
DETAIL A
(JEDEC 95)
0.50 BSC
TOP VIEW
0.50
0.40
0.30
5
8
EXPOSED
PAD
4
1
BOTTOM VIEW
1.70
1.60
1.50
0.20 MIN
PIN 1
INDIC ATOR AREA OPTIONS
(SEE DETAIL A)
SIDE VIEW
0.30
0.25
0.20
0.05 MAX
0.02 NOM
COPLANARITY
0.08
0.203 REF
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET
COMPLIANT TO JEDEC STANDARDS MO-229-W3030D-4
Figure 55. 8-Lead Lead Frame Chip Scale Package [LFCSP]
3 mm × 3 mm Body and 0.75 mm Package Height
(CP-8-11)
Dimensions shown in millimeters
Data Sheet
ORDERING GUIDE
Model¹
ADA4841-1YRZ
ADA4841-1YRZ-R7
ADA4841-1YRZ-RL
ADA4841-1YRJZ-R2
ADA4841-1YRJZ-R7
ADA4841-2YRMZ
ADA4841-2YRMZ-R7
ADA4841-2YRMZ-RL
ADA4841-2YRZ
ADA4841-2YRZ-R7
ADA4841-2YRZ-RL
ADA4841-2YCPZ-R2
ADA4841-2YCPZ-R7
ADA4841-2YCPZ-RL
Temperature Range
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
1 _{Z = RoHS Compliant Part.}
Package Description
8-Lead SOIC_N
8-Lead SOIC_N
8-Lead SOIC_N
6-Lead SOT-23
6-Lead SOT-23
8-Lead MSOP
8-Lead MSOP
8-Lead MSOP
8-Lead SOIC_N
8-Lead SOIC_N
8-Lead SOIC_N
8-Lead LFCSP
8-Lead LFCSP
8-Lead LFCSP
Package Option
R-8
R-8
R-8
RJ-6
RJ-6
RM-8
RM-8
RM-8
R-8
R-8
R-8
CP-8-11
CP-8-11
CP-8-11
Ordering Quantity
1
1,000
2,500
250
3,000
1
1,000
3,000
1
1,000
2,500
250
1,500
5,000
Branding
HQB
HQB
HRB
HRB
HRB
HRB
HRB
HRB
©2005–2017 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D05614–0–3/17(G)
Rev. G | Page 20 of 20