AD8541_15 Datasheet, PDF (18/20 Pages) Analog Devices – CMOS Rail-to-Rail General-Purpose Amplifiers

AD8541/AD8542/AD8544
3.20
3.00
2.80
3.20
3.00
2.80
8
5
5.15
4.90
4.65
1
4
PIN 1
IDENTIFIER
0.65 BSC
0.95
15° MAX
0.85
1.10 MAX
0.75
0.15
0.05
0.40
COPLANARITY
0.25
6°
0.23
0°
0.09
0.80
0.55
0.40
0.10
COMPLIANT TO JEDEC STANDARDS MO-187-AA
Figure 45. 8-Lead Mini Small Outline Package [MSOP]
(RM-8)
Dimensions shown in millimeters
5.00 (0.1968)
4.80 (0.1890)
8
4.00 (0.1574)
3.80 (0.1497) ¹
5
6.20 (0.2441)
4 ^{5.80 (0.2284)}
3.10
3.00
2.90
8
5
4.50
4.40 6.40 BSC
4.30
1
4
PIN 1
0.65 BSC
0.15
0.05
1.20
MAX
8°
COPLANARITY
0.10
0.30
0.19
SEATING _0.20
PLANE _0.09
0°
0.75
0.60
0.45
COMPLIANT TO JEDEC STANDARDS MO-153-AA
Figure 46. 8-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-8)
Dimensions shown in millimeters
0.25 (0.0098)
0.10 (0.0040)
1.27 (0.0500)
BSC
1.75 (0.0688)
1.35 (0.0532)
COPLANARITY
0.10
SEATING
PLANE
0.51 (0.0201)
0.31 (0.0122)
0.50 (0.0196) _45°
0.25 (0.0099)
8°
0°
1.27 (0.0500)
0.25 (0.0098) _{0.40 (0.0157)}
0.17 (0.0067)
COMPLIANT TO JEDEC STANDARDS MS-012-AA
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
Figure 47. 8-Lead Standard Small Outline Package [SOIC_N]
Narrow Body
(R-8)
Dimensions shown in millimeters and (inches)
Rev. G | Page 18 of 20