AD8698_15 Datasheet, PDF (17/20 Pages) Analog Devices – Dual Precision, Rail-to-Rail Output

OUTLINE DIMENSIONS
5.00 (0.1968)
4.80 (0.1890)
8
4.00 (0.1574)
3.80 (0.1497) 1
5
6.20 (0.2440)
4 ^{5.80 (0.2284)}
0.25 (0.0098)
0.10 (0.0040)
COPLANARITY
0.10
1.27 (0.0500)
BSC
1.75 (0.0688)
1.35 (0.0532)
0.50
0.25
(0.0196)
(0.0099)
×
45°
0.51 (0.0201)
SEATING ^{0.31 (0.0122)}
PLANE
8°
0.25 (0.0098) ^{0° 1.27 (0.0500)}
0.17 (0.0067) ^{0.40 (0.0157)}
COMPLIANT TO JEDEC STANDARDS MS-012AA
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
Figure 58. 8-Lead Small Outline IC [SOIC] (R-8)—Dimensions shown in millimeters
3.00
BSC
8
3.00
BSC
5
4.90
BSC
4
PIN 1
0.65 BSC
0.15
1.10 MAX
0.00
0.38
0.22
0.80
0.23
0.08
8°
0°
0.60
0.40
COPLANARITY SEATING
0.10
PLANE
COMPLIANT TO JEDEC STANDARDS MO-187AA
Figure 59. 8-Lead Small Outline IC [SOIC] (RM-8)—Dimensions shown in millimeters
AD8698
ORDERING GUIDE
Model
AD8698ARM-R2
AD8698ARM-REEL
AD8698AR
AD8698AR-REEL
AD8698AR-REEL7
Temperature Package
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
Package Description
MSOP
MSOP
SOIC
SOIC
SOIC
Package Option
RM-8
RM-8
R-8
R-8
R-8
Branding
A02
A02
Rev. 0 | Page 17 of 20