ADCMP563_15 Datasheet, PDF (15/16 Pages) Analog Devices – Dual, High Speed ECL Comparators

ADCMP563/ADCMP564
ORDERING GUIDE
Model¹
ADCMP563BRQZ
ADCMP563BCPZ-R2
ADCMP563BCPZ-RL7
ADCMP563BCPZ-WP
EVAL-ADCMP563BRQZ
ADCMP564BRQZ
EVAL-ADCMP564BRQZ
PIN 1
INDICATOR
3.00
BSC SQ
TOP
VIEW
2.75
BSC SQ
0.45
0.50
0.40
0.60 MAX
0.30
BOTTOM VIEW
13
12
16 ₁
EXPOSED
PAD
PIN 1
INDICATOR
*1.65
1.50 SQ
1.35
12° MAX
0.90
0.85
0.80
SEATING
PLANE
0.30
0.23
0.18
9
0.50
BSC
8
4
5
0.25 MIN
0.80 MAX
0.65 TYP
0.05 MAX
0.02 NOM
1.50 REF
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
0.20 REF
*COMPLIANT _{TO JEDEC STANDARDS MO-220-VEED-2}
EXCEPT FOR EXPOSED PAD DIMENSION.
Figure 30. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
3 mm × 3 mm Body, Very Thin Quad
(CP-16-3)
Dimensions shown in millimeters
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
Package Description
16-Lead QSOP
16-Lead LFCSP_VQ, 250 Unit Reel
16-Lead LFCSP_VQ, 1,500 Unit Reel
16-Lead LFCSP_VQ, 50 Unit Waffle Pack
Evaluation Board
20-Lead QSOP
Evaluation Board
Package Option
RQ-16
CP-16-3
CP-16-3
CP-16-3
RQ-20
1 _{Z = RoHS Compliant Part.}
Branding
G01
G01
G01
Rev. C | Page 15 of 16