AD9627_15 Datasheet, PDF (15/76 Pages) Analog Devices – 12-Bit, 80 MSPS/105 MSPS/125 MSPS/150 MSPS

ABSOLUTE MAXIMUM RATINGS
Table 9.
Parameter
ELECTRICAL
AVDD, DVDD to AGND
DRVDD to DRGND
AGND to DRGND
AVDD to DRVDD
VIN+A/VIN+B, VIN−A/VIN−B to AGND
CLK+, CLK− to AGND
SYNC to AGND
VREF to AGND
SENSE to AGND
CML to AGND
RBIAS to AGND
CSB to AGND
SCLK/DFS to DRGND
SDIO/DCS to DRGND
SMI SDO/OEB
SMI SCLK/PDWN
SMI SDFS
D0A/D0B through D11A/D11B to
DRGND
FD0A/FD0B through FD3A/FD3B to
DRGND
DCOA/DCOB to DRGND
ENVIRONMENTAL
Operating Temperature Range
(Ambient)
Maximum Junction Temperature
Under Bias
Storage Temperature Range
(Ambient)
Rating
−0.3 V to +2.0 V
−0.3 V to +3.9 V
−0.3 V to +0.3 V
−3.9 V to +2.0 V
−0.3 V to AVDD + 0.2 V
−0.3 V to +3.9 V
−0.3 V to +3.9 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to +3.9 V
−0.3 V to +3.9 V
−0.3 V to DRVDD + 0.3 V
−0.3 V to DRVDD + 0.3 V
−0.3 V to DRVDD + 0.3 V
−0.3 V to DRVDD + 0.3 V
−0.3 V to DRVDD + 0.3 V
−0.3 V to DRVDD + 0.3 V
−0.3 V to DRVDD + 0.3 V
−40°C to +85°C
150°C
−65°C to +150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
AD9627
THERMAL CHARACTERISTICS
The exposed paddle must be soldered to the ground plane for
the LFCSP package. Soldering the exposed paddle to the customer
board increases the reliability of the solder joints and maximizes
the thermal capability of the package.
Table 10. Thermal Resistance
Package
Type
Airflow
Velocity
(m/s)
θJA1, ²
64-Lead LFCSP 0
18.8
9 mm × 9 mm _1.0
16.5
(CP-64-6)
2.0
15.8
θJC1, ³
0.6
θJB1, ⁴
6.0
Unit
°C/W
°C/W
°C/W
1 _{Per JEDEC 51-7, plus JEDEC 25-5 2S2P test board.}
2 _{Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).}
3 _{Per MIL-Std 883, Method 1012.1.}
4 _{Per JEDEC JESD51-8 (still air).}
Typical θJA is specified for a 4-layer PCB with a solid ground
plane. As shown, airflow improves heat dissipation, which
reduces θJA. In addition, metal in direct contact with the package
leads from metal traces, through holes, ground, and power
planes, reduces the θJA.
ESD CAUTION
Rev. B | Page 15 of 76