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| ADXL335_10 Datasheet, PDF (13/16 Pages) Analog Devices – Small, Low Power, 3-Axis ±3 g Accelerometer | |||
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ADXL335
LAYOUT AND DESIGN RECOMMENDATIONS
The recommended soldering profile is shown in Figure 25 followed by a description of the profile features in Table 6. The recommended
PCB layout or solder land drawing is shown in Figure 26.
TP
TL
TSMAX
TSMIN
tP
RAMP-UP
CRITICAL ZONE
TL TO TP
tL
tS
PREHEAT
RAMP-DOWN
t25°C TO PEAK
TIME
Figure 25. Recommended Soldering Profile
Table 6. Recommended Soldering Profile
Profile Feature
Average Ramp Rate (TL to TP)
Preheat
Minimum Temperature (TSMIN)
Maximum Temperature (TSMAX)
Time (TSMIN to TSMAX)(tS)
TSMAX to TL
Ramp-Up Rate
Time Maintained Above Liquidous (TL)
Liquidous Temperature (TL)
Time (tL)
Peak Temperature (TP)
Time Within 5°C of Actual Peak Temperature (tP)
Ramp-Down Rate
Time 25°C to Peak Temperature
Sn63/Pb37
3°C/sec max
100°C
150°C
60 sec to 120 sec
3°C/sec max
183°C
60 sec to 150 sec
240°C + 0°C/â5°C
10 sec to 30 sec
6°C/sec max
6 minutes max
0.35
MAX
0.50
MAX
4
0.65
0.325
0.65
1.95
EXPOSED PAD IS NOT
INTERNALLY CONNECTED
BUT SHOULD BE SOLDERED
FOR MECHANICAL INTEGRITY.
4
0.325
1.95
DIMENSIONS SHOWN IN MILLIMETERS
Figure 26. Recommended PCB Layout
Pb-Free
3°C/sec max
150°C
200°C
60 sec to 180 sec
3°C/sec max
217°C
60 sec to 150 sec
260°C + 0°C/â5°C
20 sec to 40 sec
6°C/sec max
8 minutes max
Rev. B | Page 13 of 16
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