AD8661_06 Datasheet, PDF (13/16 Pages) Analog Devices – Low Noise, Precision 16 V CMOS, Rail-to-Rail Operational Amplifiers

OUTLINE DIMENSIONS
AD8661/AD8662/AD8664
5.00 (0.1968)
4.80 (0.1890)
8
4.00 (0.1574)
3.80 (0.1497) ¹
5
6.20 (0.2440)
4 ^{5.80 (0.2284)}
0.25 (0.0098)
0.10 (0.0040)
1.27 (0.0500)
BSC
1.75 (0.0688)
1.35 (0.0532)
COPLANARITY
0.10
SEATING
PLANE
0.51 (0.0201)
0.31 (0.0122)
0.50 (0.0196) _45°
0.25 (0.0099)
8°
0°
1.27 (0.0500)
0.25 (0.0098) _{0.40 (0.0157)}
0.17 (0.0067)
COMPLIANT TO JEDEC STANDARDS MS-012-A A
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
Figure 34. 8-Lead Small Outline Package [SOIC_N]
Narrow Body
(R-8)
Dimensions shown in millimeters and (inches)
3.00
BSC SQ
PIN 1
INDICATOR
TOP
VIEW
0.60 MAX
2.75
BSC SQ
8
0.50
BSC
5
0.50
0.40
0.30
PIN 1
INDICATOR
1
1.50
REF
1.89
1.74
1.59
4
1.60
0.90 MAX ^{12° MAX}
0.70 MAX
0.65 TYP
1.45
1.30
0.85 NOM
0.05 MAX
0.01 NOM
SEATING
0.30
PLANE
0.23
0.18
0.20 REF
Figure 35. 8-Lead Lead Frame Chip Scale Package [LFCSP_VD]
3 mm x 3 mm Body, Very Thin, Dual Lead
(CP-8-2)
Dimensions shown in millimeters
Rev. D | Page 13 of 16