AD565A_15 Datasheet, PDF (11/12 Pages) Analog Devices – High Speed 12-Bit Monolithic D/A Converters

OUTLINE DIMENSIONS
24-Lead Side-Brazed Solder Lid Ceramic DIP [DIP/SB]
(D-24)
Dimensions shown in inches and (millimeters)
0.005 (0.13) MIN
0.098 (2.49) MAX
24
13
PIN 1
1
0.610 (15.49)
0.500 (12.70)
12
1.290 (32.77) MAX
0.075 (1.91)
0.225 (5.72)
0.015 (0.38)
MAX
0.150
0.200 (5.08)
(3.81)
0.120 (3.05)
MIN
0.023 (0.58)
0.014 (0.36)
0.100 (2.54)
BSC
0.070 (1.78)
0.030 (0.76)
SEATING
PLANE
0.620 (15.75)
0.590 (14.99)
0.015 (0.38)
0.008 (0.20)
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
AD565A/AD566A
28-Lead Standard Small Outline Package [SOIC]
Wide Body
(RW-28)
Dimensions shown in millimeters and (inches)
18.10 (0.7126)
17.70 (0.6969)
28
15
7.60 (0.2992)
7.40 (0.2913)
10.65 (0.4193)
1
14
10.00 (0.3937)
0.30 (0.0118)
0.10 (0.0039)
COPLANARITY
0.10
2.65 (0.1043)
2.35 (0.0925)
0.75 (0.0295)
0.25 (0.0098) ^{؋ 45؇}
8؇
1.27 (0.0500)
BSC
0.51 (0.0201)
0.33 (0.0130)
SEATING
PLANE
0.32 (0.0126)
0.23 (0.0091)
0؇
1.27 (0.0500)
0.40 (0.0157)
COMPLIANT TO JEDEC STANDARDS MS-013AE
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
Revision History
Location
Page
10/02—Data Sheet changed from REV. D to REV. E.
Edits to SPECIFICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
OUTLINE DIMENSIONS updated . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
REV. E
–11–