AD9249 Datasheet, PDF (10/36 Pages) Analog Devices – 16 Channel, 14-Bit, 65 MSPS, Serial LVDS, 1.8 V ADC

AD9249
ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter
Electrical
AVDD to GND
DRVDD to GND
Digital Outputs
(D±x1, D±x2, DCO±1, DCO±2,
FCO±1, FCO±2) to GND
CLK+, CLK− to GND
VIN±x1, VIN±x2 to GND
SCLK/DTP, SDIO/DFS, CSB1, CSB2 to GND
SYNC, PDWN to GND
RBIAS1, RBIAS2 to GND
VREF, VCM1, VCM2, SENSE to GND
Environmental
Operating Temperature Range (Ambient)
Maximum Junction Temperature
Lead Temperature (Soldering, 10 sec)
Storage Temperature Range (Ambient)
Rating
−0.3 V to +2.0 V
−0.3 V to +2.0 V
−0.3 V to +2.0 V
−0.3 V to +2.0 V
−0.3 V to +2.0 V
−0.3 V to +2.0 V
−0.3 V to +2.0 V
−0.3 V to +2.0 V
−0.3 V to +2.0 V
−40°C to +85°C
150°C
300°C
−65°C to +150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Data Sheet
THERMAL CHARACTERISTICS
Typical θJA is specified for a 4-layer PCB with a solid ground plane.
Airflow improves heat dissipation, which reduces θJA. In addition,
metal in direct contact with the package leads from metal traces,
through holes, ground, and power planes reduces θJA.
Table 7. Thermal Resistance (Simulated)
Package Type
Airflow Velocity
(m/sec)
θJA1, ²
144-Ball,
0
30.2
10 mm × 10 mm
CSP-BGA
ΨJT1, ²
0.13
Unit
°C/W
1 _{Per JEDEC 51-7, plus JEDEC 51-5 2S2P test board.}
2 _{Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).}
ESD CAUTION
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