SSM2275 Datasheet, PDF (1/16 Pages) Analog Devices – Rail-to-Rail Output Audio Amplifiers

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Rail-to-Rail Output
Audio Amplifiers
SSM2275/SSM2475*
FEATURES
Single or Dual-Supply Operation
Excellent Sonic Characteristics
Low Noise: 7 nV/√Hz
Low THD: 0.0006%
Rail-to-Rail Output
High Output Current: ؎50 mA
Low Supply Current: 1.7 mA/Amplifier
Wide Bandwidth: 8 MHz
High Slew Rate: 12 V/␮s
No Phase Reversal
Unity Gain Stable
Stable Parameters Over Temperature
APPLICATIONS
Multimedia Audio
Professional Audio Systems
High Performance Consumer Audio
Microphone Preamplifier
MIDI Instruments
GENERAL DESCRIPTION
The SSM2275 and SSM2475 use the Butler Amplifier front
end, which combines both bipolar and FET transistors to offer
the accuracy and low noise performance of bipolar transistors
and the slew rates and sound quality of FETs. This product
family includes dual and quad rail-to-rail output audio amplifi-
ers that achieve lower production costs than the industry stan-
dard OP275 (the first Butler Amplifier offered by Analog
Devices). This lower cost amplifier also offers operation from a
single 5 V supply, in addition to conventional ± 15 V supplies.
The ac performance meets the needs of the most demanding au-
dio applications, with 8 MHz bandwidth, 12 V/µs slew rate and
extremely low distortion.
The SSM2275 and SSM2475 are ideal for application in high
performance audio amplifiers, recording equipment, synthesiz-
ers, MIDI instruments and computer sound cards. Where cas-
caded stages demand low noise and predictable performance,
SSM2275 and SSM2475 are a cost effective solution. Both are
stable even when driving capacitive loads.
The ability to swing rail-to-rail at the outputs (see Applications sec-
tion) and operate from low supply voltages enables designers to at-
tain high quality audio performance, even in single supply systems.
The SSM2275 and SSM2475 are specified over the extended
industrial (–40°C to +85°C) temperature range. The SSM2275 is
available in 8-lead plastic DIPs, SOICs, and microSOIC surface-
mount packages. The SSM2475 is available in narrow body
SOICs and thin shrink small outline (TSSOP) surface-mount
packages.
*Protected by U.S. Patent No. 5,101,126.
REV. A
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties
which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of Analog Devices.
PIN CONFIGURATIONS
8-Lead Narrow Body SOIC 14-Lead Narrow Body SOIC
(SO-8)
(R-14)
OUT A 1
8 _V+
–IN A 2 _SSM2275 7 OUT B
(Not to Scale)
+IN A 3
6 –IN B
V– ⁴
5 +IN B
8-Lead microSOIC
(RM-8)
OUT A 1
14 OUT D
–IN A 2
13 –IN D
+IN A 3
12 +IN D
V+ 4 ^SSM2475 11 V–
(Not to Scale)
+IN B 5
10 +IN C
–IN B 6
9 –IN C
OUT B 7
8 OUT C
14-Lead TSSOP
(RU-14)
OUT A
–IN A
+IN A
V–
1
8
SSM2275
4
5
V+
OUT B
–IN B
+IN B
OUT A
–IN A
+IN A
V+
+IN B
–IN B
OUT B
1
14
SSM2475
7
8
OUT D
–IN D
+IN D
V–
+IN C
–IN C
OUT C
8-Lead Plastic DIP
(N-8)
OUT A 1
–IN A 2
(Not to
Scale)
8 V+
7 OUT B
+IN A 3
6 –IN B
V– 4
SSM2275
5 +IN B
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© Analog Devices, Inc., 1999