EVAL-1CH2CHSOICEBZ Datasheet, PDF (1/8 Pages) Analog Devices – Access to 2 data channels

EVAL-1CH2CHSOICEBZ User Guide
UG-937
One Technology Way • P.O. Box 9106 • Norwood, MA 02062-9106, U.S.A. • Tel: [phone] • Fax: [phone] • www.analog.com
Using the EVAL-1CH2CHSOICEBZ iCoupler Standard Data Isolator Evaluation Board
FEATURES
Access to 2 data channels
Multiple connection options
Support for active probes
Provisions for cable terminations
Support for printed circuit board (PCB) edge mounted
coaxial connectors
Easy configuration
SUPPORTED iCoupler DEVICES
Sample iCoupler digital isolators must be ordered separately;
supported iCoupler devices are as follows:
ADuM110N
ADuM120N/ADuM121N
ADuM210N
ADuM225N/ADuM226N
ADuM7240/ADuM7241
ADuM1200/ADuM1201
ADuM1210
ADuM3200/ADuM3201
ADuM3210/ADuM3211
ADuM1280/ADuM1281
GENERAL DESCRIPTION
The EVAL-1CH2CHSOICEBZ supports single- and dual-channel
iCoupler® standard data isolators in 8-lead SOIC packages. The
evaluation board provides a JEDEC standard, 8-lead SOIC_N
and 8-lead SOIC_W pad layout. This layout supports signal
distribution, loopback, and loads referenced to the VDDx or
GNDx planes, as well as optimal bypass capacitance. Signal
sources can be conducted to the board through header pins or
through edge mounted SMA connectors (SMA connectors must
be ordered separately). Screw terminal blocks on the board provide
power connections. The board includes 0.2 inch header positions
for compatibility with active probes (probe header pins must be
ordered separately).
The evaluation board follows best PCB design practices for 4-layer
boards, including a full power and ground plane on each side of
the isolation barrier. No other electromagnetic interference (EMI)
or noise mitigation design features are included on this board.
In cases of high speed operation, or when ultralow emissions are
required, refer to the AN-1109 Application Note for additional
board layout techniques.
PHOTOGRAPH OF THE EVALUATION BOARD
PLEASE SEE THE LAST PAGE FOR AN IMPORTANT
WARNING AND LEGAL TERMS AND CONDITIONS.
Figure 1.
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