AD565_15 Datasheet, PDF (1/3 Pages) Analog Devices – COMPLETE HIGH SPEED 12 BIT MONOLITHIC D/A CONVERTER

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DEVICES
CompleteHighSpeed12-Bit
Monolithic0/ A Converter
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FEATURES
Single Chip Construction
Very High Speed: Settles to 1/2LSB in 200ns
Full Scale Switching Time: 30ns
High Stability Buried Zener Reference on Chip
Monotonicity Guaranteed Over Temperature
Linearity Guaranteed Over Temperature: 1/2LSB max
(AD565K, T)
OBSOLETE Low Power: 225mW Including Reference
Pin-Out Compatible with AD563
Low Cost ($16.00 in 100's AD565JN)
PKODUCT DESCKIPTION
The AD565 is a fast 12-bit digital-to-analog converter combined
with a high stability voltage reference on a single monolithic
chip. The AD565 chip uses 12 precision, high speed bipolar cur-
rent steering switches, control amplifier, laser-trimmed thin film
resistor network, and buried Zener voltage reference to pro-
duce a very fast, high accuracy analog output current.
The combination of performance and flexibility in the AD565
has resulted from major innovations in circuit design, an im-
portant new high-speed bipolar process, and continuing ad-
vances in laser-wafer-trimming techniques (LWT). The AD565
P!?ODlJrT HIGHlIGHTS
1. The AD565 is a self-contained current output DAC and
voltage reference fabricated on a single 1C chip.
2. The device incorporates a newly developed. fu lly differen-
tial, non-saturating precision current switching cell structure
which combines the dc accuracy and stability first developed
in the AD562 with very fast switching times and an opti-
mally-damped settling characteristic.
has a 10 -. 90% full scale transition time under 35 nanoseconds
3. The internal buried zener reference is laser-trimmed to
and settles to within :t1/2LSB in 200 nanoseconds. AD565
10.00 volts with a :t1% maximum error. The reference volt-
chips are laser-trimmed at the wafer level to ::t1/8LSB typical
linearity and are specified to :t1/4LSB max error (K and T
grades) at +25°c. This high speed and accuracy make the
age is available externally and can supply up to 1. 5mA
beyond that required for the reference and bipolar offset
resistors.
AD565 the ideal choice for high speed display drivers as well
as fast analog-to-digital converters.
4. The chip also contains SiCr thin film application resistors
which can be used either with an external op amp to pro-
The subsurface (buried) Zener diode on the chip provides a
vide a precision voltage output or as input resistors for a
low-noise voltage reference which has long-term stability and
successive approximation AID converter. The resistors are
temperature drift characteristics comparable to the best dis-
matched to the internal ladder network to guarantee a low
crete reference diodcs. The laser trimming process which pro-
gain temperature coefficient and are laser-trimmed for mini-
vides the excellent linearity is also used to trim both the abso-
mum full scale and bipolar offset errors.
lute value of the refercnce as well as its temperatUrc coefficient.
The AD565 is thus well suited for wide temperature rangc
performance with maximum linearity error ::t1/2LSB and
guaranteed monotonicity over the full temperature range.
Typical full scale gain T.c. is 10ppm/°c.
5. The pin-out of the AD565 is compatible with the industry-
standard AD563 so that a system can easily be upgraded to
higher speed performance without board changes.
6. The single-chip construction makes the AD 56 5 inherently
more reliable than hybrid multi-chip designs. The AD565S
The AD 56 5 is available in four performance grades and two
and T grades with guaranteed linearity and monotonicity
package types. The AD565J and K are specified for use over
over the -55° C to + 125" C range are especially recommended
the 0 to 70°C temperatUre range and arc both available in
for high reliability needs in harsh environments. These units
either a 24-pin, hermetically-sealed, side-brazed ceramic DIP,
are available fully processed to MIL-STD-883, Level B.
or a 24 pin plastic DIP. The AD565S and T grades are specified
for the -55° C to +12 5° C range and are available in the
ceramic package.
.Covered by patent numbers: 3,803,590; 3,890,611; 3,932,863;
3,978,473; 4,020,486; and other patents pending.
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