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AD1803_15 Datasheet, PDF (1/32 Pages) Analog Devices – Modem/Telephony Codec
FEATURES
Low power modem/telephony codec
16-bit oversampling Σ-Δ converter technology
Intel® AC ‘97 Rev 2.1-compliant modem codec
implementation
AC ‘97 or DSP style serial interface
Supports all modem/fax standards, including V.90
Multiple crystal/clock rates supported
Programmable gain, attenuation, and mute
On-chip signal filters
Digital interpolation and decimation filters
Analog output low pass
Programmable sample rates
From 6.4 kHz to 16 kHz
With 1 Hz, 8/7 Hz, and 10/7 Hz resolution
Digital codec engine with variable sample rate
conversion
Digital monitor speaker output
24-lead TSSOP
0.6 μm CMOS technology
Operation from 3.3 V or 5 V supply
Advanced power management
APPLICATIONS
Modems (PC and embedded)
Voice and telephony
Fax machines, answering machines, speakerphones
PBX systems
Smart appliances
GENERAL DESCRIPTION
The AD1803 is a low power, 16-bit codec for modem,
voice/handset, and telephony applications. It can also
be used as a cellular telephone interface.
The AD1803 is an Intel AC '97 Rev 2.1-compliant modem
codec (refer to documentation about the Intel AC '97) with
selectable AC '97 or a DSP-style serial interface.
The AD1803 codec uses high performance Σ-Δ ADCs and
DACs with programmable gain/attenuation. It has a digital
Σ-Δ monitor output with selectable mix from ADC and DAC
channels for call progress monitoring.
Modem/Telephony Codec
AD1803
FUNCTIONAL BLOCK DIAGRAM
AVDD
AGND
DVDD
DGND
BIT_CLK
SYNC
SDATA_IN
SDATA_OUT
RESET
AD1803
VOLTAGE
REFERENCE
ADC
FILTER
DAC
FILTER
Σ-Δ ADC
+20dB MUX
PWM BLOCK
Σ-Δ MODULATOR
DAC FILTER
+ GAIN
/ATTEN
VREF
G[1]/MIC
Rx
FILT
G[4]/MOUT
Tx
CLK_OUT
XTALO
XTALI
ADDRESS
REGISTER
CONTROL
REGISTERS
REGISTER CONTROL LOGIC
Figure 1.
G[0]
G[2]
G[3]/WAKE
G[5]
G[6]
G[7]
The AD1803 supports advanced power management with
several power saving modes. The codec supports seven general-
purpose input/output (GPIO) pins and a wake interrupt signaling
mechanism on GPIO events.
The AD1803JRUZ is a lead-free environmentally friendly
product. It is manufactured using the most up-to-date mate
rials and processes. The coating on the leads of each device is
100% pure tin electroplate. The device is suitable for lead-free
applications and can withstand surface-mount soldering at up to
255°C (±5°C). In addition, it is backward compatible with
conventional tin-lead soldering processes. This means that the
electroplated tin coating can be soldered with tin-lead solder
pastes at reflow temperatures of 220°C to 235°C.
Rev. A
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