BPW128-0830-12CB95 Datasheet, PDF (4/8 Pages) Actel Corporation – SE-CSG128-H, E-Tec lead free prototype socket drawing for CSG128 and CSG128 packages

Socket Mounting Recommendations and Reflow Profile
Stencil
Table 1 shows the recommended stencil dimensions. A laser-cut, electro-polished and Ni-plated
stainless steel stencil is recommended to give the most consistent paste release. The apertures
can be made round except for smaller pitches, where square apertures are recommended.
Remember to keep the stencil small enough to fit within the keep-out area of the socket, but yet
have provisions to remove it from the PCB once the paste has been applied.
Table 1: Recommended stencil dimensions.
Device Pitch
PCB Pad Diameter
(mm)
(mm / in)
1.27
min. 0.60 / 0.023
1.00
min. 0.50 / 0.019
0.80
min. 0.40 / 0.016
0.75
min. 0.35 / 0.014
0.65
min. 0.35 / 0.014
0.50
min. 0.30 / 0.012
Stencil Thickness
(mm/in)
0.15 / 0.006
0.15 / 0.006
0.13 / 0.005
0.13 / 0.005
0.13 / 0.005
0.13 / 0.005
Stencil Aperture
(mm/in)
round 0.66 / 0.026
round 0.55 / 0.022
round 0.44 / 0.017
square 0.39 / 0.015
square 0.39 / 0.015
square 0.33 / 0.013
Solder Paste
E-tec recommends using solder paste without ( or <0.5%) silver (Ag) to reduce the solder’s
wetting ability and prevent the paste from running up the pins, thus maximizing the volume of
solder left on the pads. Brands such as Qualitek (www.qualitek.com) or Alpha Metals
(www.alphametals.com) produce such solder paste on customer request. For Sn/Pb solder paste
we recommend Ecorel 803S offered by Avantec (www.avantec.dehon.com).
Reflow Profile
Both standard Sn-Pb eutectic and Pb-free reflow profiles are shown below.
E-tec Interconnect Ltd, Industrial Zone C, CH-1072 Forel (Lavaux), Switzerland
2
Phone [phone] · www.e-tec.com · [e-mail]
E-tec Socket Mounting Recommendations
PRELIMINARY