A54SX32-1CQ208B Datasheet, PDF (24/64 Pages) Actel Corporation – Leading Edge Performance

SX Family FPGAs
Table 1-15 • Package Thermal Characteristics
Package Type
Plastic Leaded Chip Carrier (PLCC)
Thin Quad Flat Pack (TQFP)
Thin Quad Flat Pack (TQFP)
Very Thin Quad Flatpack (VQFP)
Plastic Quad Flat Pack (PQFP) without Heat Spreader
Plastic Quad Flat Pack (PQFP) with Heat Spreader
Plastic Ball Grid Array (PBGA)
Plastic Ball Grid Array (PBGA)
Plastic Ball Grid Array (PBGA)
Fine Pitch Ball Grid Array (FBGA)
Note: SX08 does not have a heat spreader.
Pin Count
θ_jc
84
12
144
11
176
11
100
10
208
8
208
3.8
272
3
313
3
329
3
144
3.8
θ_ja
Still Air
32
32
28
38
30
20
20
23
18
38.8
θ_ja
300 ft/min.
22
24
21
32
23
17
14.5
17
13.5
26.7
Units
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Table 1-16 • Temperature and Voltage Derating Factors*
Junction Temperature
V_CCA
3.0
–55
–40
0
25
70
85
125
0.75
0.78
0.87
0.89
1.00
1.04
1.16
3.3
0.70
0.73
0.82
0.83
0.93
0.97
1.08
3.6
0.66
0.69
0.77
0.78
0.87
0.92
1.02
Note: *Normalized to worst-case commercial, T_J = 70°C, V_CCA = 3.0 V
1-20
v3.2