1MD Datasheet, PDF (10/10 Pages) Accetek Electronics (Shenzhen) Co., Ltd. – Available for ultra low profile

Accetek
F RECOMMENDED SOLDER REFLOW PROFILE
1MD Series
Shielded Power Inductor
Package
Thickness
< 1.6mm
1.6mm - 2.5mm
>2.5mm
Profile Feature
Average ramp-up rate
(Tsmax to Tp)
Preheat
Temperature Min (Ts_min)
Temperature Max (Ts_max)
Time (Ts_min to Ts_max)(ts)
Time maintained above:
Temperature (T_L)
Time (t_L)
Peak Temperature (Tp)
Time within 5^°C of actual Peak
Temperature (tp)²
Ramp-down Rate
Time 25^°C to Peak Temperature
Recommended Conditions
3^°C/second max.
100^°C
150^°C
60-180 seconds
217^°C
60-150 seconds
See Table2
20-40 seconds
6^°C/second max.
8 minutes max
Table 1
Volume mm³
<350
260^°C
260^°C
250^°C
Volume mm³
350 - 2000
260^°C
250^°C
245^°C
Volume mm³
>2000
260^°C
245^°C
245^°C
Table 2
1. The above profiles are based on IPC/JEDEC J-STD-020C.
2. Exceeding these conditions may cause lowered product
reliability.
Accetek Electronics (Shenzhen) Co., Ltd.
www.accetek.com
Ver.:1MD‐2012A
10