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SW10051N0DL Datasheet, PDF (7/8 Pages) ABC Taiwan Electronics Corp – WOUND CHIP INDUCTOR | |||
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SPECIFICATION FOR APPROVAL
REF : 20080711-B
PAGE: 7
PROD.
NAME
WOUND CHIP INDUCTOR
ABC'S DWG NO.
ABC'S ITEM NO.
SW1005â¡â¡â¡â¡Lâ¡-â¡â¡â¡
Component
adhesion
(Push test)
20Nï¼2012ï¼2520ï¼3225
10Nï¼1608
5Nï¼1005
The device shall be reflow soldered
(230±5â for 10 seconds) to a tinned
copper substrate. A dynometer
force gauge shall be applied to
the side of the component . The
device must withstand the minimum
force indicated at left without a failure
of the termination to board
attachment.
Temperature
characteristic
Humidity test
Low temperature
storage
1.There shall be no case
deformation or change in
appearance.
2.Inductance shall not change
more than ±5%
3.Q shall not change
more than±10%
-55â~125â
Temp.ï¼50±2â
R.H.ï¼90~95 %
Time.ï¼96±2 hours
Temp.ï¼-40±2â
Time.ï¼48±2 hours
Thermal shock test
High temperature
storage
-40â for 30 minutes.
+125â for 30 minutes.
Totalï¼10 cycles
Temp.ï¼125±2â
Time.ï¼48±2 hours
Noteï¼ Inductors are to be tested after 1 hour at room temperature.
High tempera - ture
load life test
Inductors shall not have a
shorted or open winding.
Humidity load life
1.Tempï¼85±2â
2.Timeï¼1000±12 hours
3.Loadï¼Allowed DC current
1.Tempï¼40±2â
2.R.H.ï¼90-95%
3.Timeï¼1000±12 hours
4. Loadï¼Allowed DC current
AR-001A
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