SW16081N6DL Datasheet, PDF (1/9 Pages) ABC Taiwan Electronics Corp – WOUND CHIP INDUCTOR

SPECIFICATION FOR APPROVAL
REF : 20090828-C
PAGE: 1
PROD.
NAME
WOUND CHIP INDUCTOR
ABC'S DWG NO.
ABC'S ITEM NO.
SW1608□□□□L□-□□□
Ⅰ﹒CONFIGURATION & DIMENSIONS：
A
EFE
A : 1.60±0.2
m/m
B : 1.05±0.2
m/m
C : 1.05±0.2
m/m
D : 0.50
m/m
E : 0.35
m/m
F : 0.90
m/m
G : 0.70
m/m
H : 1.20
m/m
I : 0.45
m/m
Ⅱ﹒SCHEMATIC DIAGRAM：
IGI
( PCB Pattern )
d
Ⅲ﹒MATERIALS：
a﹒Core：Ceramic
b﹒WIRE ：Enamelled copper wire (class H)
c﹒Terminal：Mo / Mn + Ni + Au
d﹒Encapsulate：Epoxy
e﹒Remark：Products comply with RoHS'
requirements
Ⅳ﹒GENERAL SPECIFICATION：
a﹒Temp rise ：15℃ max.
b﹒Rated current：Current cause inductance
drop within 10% max.
c﹒Storage temp.：-40℃ ----+125℃
d﹒Operating temp.：-40℃----+125℃
AR-001A
a
c
Peak Temp：260℃ max.
Max time above 230℃ ：50sec max.
Max time above 200℃ ：70sec max.
Tempera tu re
Rising Area
Preheat Area
+4.0℃ / sec max.
150 ~ 200℃ / 60 ~ 120sec
250
200
b
Reflow Area
+2.0 ~ 4.0℃
/ sec max.
Forced Cooling A rea
-(1.0 ~ 5.0)℃ / sec max.
Peak Temperature:
260℃
50sec max.
230℃
150
70sec max.
100
50
0
50
100
150
200
250
Time ( seconds )