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SU80403R3YF Datasheet, PDF (1/7 Pages) ABC Taiwan Electronics Corp – SHIELDED SMD POWER INDUCTOR | |||
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SPECIFICATION FOR APPROVAL
REF :20080805-A
PAGE: 1
PROD.
NAME
SHIELDED SMD
ABC'S DWG NO.
POWER INDUCTOR ABC'S ITEM NO.
SU8040â¡â¡â¡â¡Fâ¡-â¡â¡â¡
â
ï¹CONFIGURATION & DIMENSIONSï¼
A
Marking
White
B
F
A : 8.00 ±0.3
m/m
B : 8.00 ±0.3
m/m
C : 3.80 ±0.3
m/m
D : 2.40 typ. m/m
E : 3.20 typ. m/m
F : 6.40 typ. m/m
G : 3.40 ref. m/m
H : 6.20 ref. m/m
I : 1.40 ref. m/m
IHI
I
G
H
I
or
I
â
¡ï¹SCHEMATIC DIAGRAMï¼
G
G
I
( PCB Pattern suggestion )
â
¢ï¹MATERIALSï¼
c
a
b
aï¹Coreï¼Ferrite DR core
d
bï¹Coreï¼Ferrite RI core
cï¹Wire ï¼Enamelled copper wire ( Class F & H )
dï¹Adhesive ï¼Epoxy resin
eï¹Terminalï¼Ag/Ni/Sn
fï¹Remarkï¼Products comply with RoHS'
Peak Tempï¼260â max.
Max time above 230â ï¼50sec max.
Max time above 200â ï¼70sec max.
Temperatu re
Risin g Area
Pre heat Area
requirements
+4.0â / sec max.
1 50 ~ 200 â / 60 ~ 120sec
250
â
£ï¹GENERAL SPECIFICATIONï¼
200
aï¹Temp. rise ï¼40â typ.
bï¹Rated currentï¼
150
Base on temp. rise & â³L / L0A=35% typ. 100
e
Reflow Area
+2.0 ~ 4.0â
/ sec max.
Forced Coo lin g Area
-(1.0 ~ 5.0)â / sec max.
Peak Temperature:
260â
50s ec max.
230â
70sec max.
cï¹Storage temp.ï¼-40â ----+125â
50
dï¹Operating temp.ï¼-40â----+105â
eï¹Resistance to solder heatï¼260â.10 secs.
0
50
100
150
200
250
Time ( seconds )
AR-001A
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