SU60111R4YF Datasheet, PDF (1/7 Pages) ABC Taiwan Electronics Corp – SHIELDED SMD POWER INDUCTOR

SPECIFICATION FOR APPROVAL
REF :20080804-A
PAGE: 1
PROD.
NAME
SHIELDED SMD
POWER INDUCTOR
ABC'S DWG NO.
ABC'S ITEM NO.
Ⅰ﹒CONFIGURATION & DIMENSIONS：
SU6011□□□□F□-□□□
Marking
White
A
B
F
A : 6.20 ±0.30 m/m
B : 6.50 ±0.30 m/m
C : 1.10 ±0.15 m/m
D : 2.15 typ m/m
E : 2.20 typ m/m
F : 4.90 typ m/m
G : 2.40 ref m/m
H : 4.90 ref m/m
I : 1.10 ref
m/m
IHI
or
Ⅱ . SCHEMATIC DIAGRAM：
G
( PCB Pattern suggestion )
Ⅲ﹒MATERIALS：
a﹒Core：Ferrite DR core
b﹒Core：Ferrite RI core
c﹒Wire ：Enamelled copper wire (class F & H)
d﹒Adhesive ：Epoxy resin
e﹒Terminal：Ag/Ni/Sn
f﹒Remark：Products comply with RoHS'
requirements
Ⅳ﹒GENERAL SPECIFICATION：
a﹒Temp. rise ：40℃ typ.
b﹒Rated current：
Base on temp. rise & △L / L0A=35% typ.
c﹒Storage temp.：-40℃ ----+125℃
d﹒Operating temp.：-40℃----+105℃
e﹒Resistance to solder heat：260℃.10 secs.
AR-001A
ac
b
e
d
Peak Temp：260 ℃ max.
Max time above 230℃ ：50sec max.
Max time above 200℃ ：70sec max.
T em perature
Rising Area
Preheat Area
+4.0℃ / sec max.
150 ~ 200℃ / 60 ~ 120sec
250
200
150
100
50
Reflow Area
+2.0 ~ 4.0℃
/ sec max.
Forced Cooling Area
-(1.0 ~ 5.0)℃ / sec max.
P eak Temperature:
260℃
50sec max.
230℃
70sec max.
0
50
100
150
200
250
Time ( seco nds )