|
SU30091R3YL Datasheet, PDF (1/6 Pages) ABC Taiwan Electronics Corp – SHIELDED SMD POWER INDUCTOR | |||
|
SPECIFICATION FOR APPROVAL
REF :20080804-A
PAGE: 1
PROD.
NAME
SHIELDED SMD
ABC'S DWG NO.
POWER INDUCTOR ABC'S ITEM NO.
SU3009â¡â¡â¡â¡Lâ¡-â¡â¡â¡
â
ï¹CONFIGURATION & DIMENSIONSï¼
Marking
(Black)
A
A : 3.30 ±0.20 m/m
B : 3.50 ±0.20 m/m
C : 0.95 ±0.10 m/m
D : 1.10 typ. m/m
E : 0.50 typ. m/m
F : 2.30 typ. m/m
G : 1.30 ref. m/m
H : 4.20 ref. m/m
I : 1.20 ref. m/m
J : 1.80 ref. m/m
( PCB Pattern Suggestion )
â
¡ï¹SCHEMATIC DIAGRAMï¼
â
¢ï¹MATERIALSï¼
aï¹Coreï¼Ferrite DR core
bï¹Coreï¼Ferrite RI core
cï¹Wire ï¼Enamelled copper wire (class H)
dï¹Adhesive ï¼Epoxy resin
eï¹Terminalï¼Ag/Ni/Sn
fï¹Remarkï¼Products comply with RoHS'
requirements
â
£ï¹GENERAL SPECIFICATIONï¼
aï¹Temp. rise ï¼40â typ.
bï¹Rated currentï¼
Base on temp. rise & â³L / L0A=35% typ.
cï¹Storage temp.ï¼-40â ----+125â
dï¹Operating temp.ï¼-40â----+105â
eï¹Resistance to solder heatï¼260â.10 secs.
AR-001A
ac
b
e
d
Peak Tempï¼260â max.
Max time above 230â ï¼50sec max.
Max time above 200â ï¼70sec max.
Temperature
Rising Area
Preheat Area
+4.0â / sec max.
150 ~ 200â / 60 ~ 120sec
250
200
Reflow Area Forced Cooling Area
+2.0 ~ 4.0â
/ sec max.
-(1.0 ~ 5.0)â / sec max.
Peak Temperature:
260â
50sec max.
230â
150
70sec max.
100
50
0
50
100
150
200
250
Time ( second s )
|
▷ |