SU20131R0YL Datasheet, PDF (1/6 Pages) ABC Taiwan Electronics Corp – SHIELDED SMD POWER INDUCTOR

SPECIFICATION FOR APPROVAL
REF : 20080701-D
PAGE: 1
PROD.
NAME
SHIELDED SMD
ABC'S DWG NO.
POWER INDUCTOR ABC'S ITEM NO.
SU2013□□□□L□-□□□
Ⅰ﹒CONFIGURATION & DIMENSIONS：
A
A
B
A : 2.80 ±0.20
m/m
B : 2.80 ±0.20
m/m
C : 1.35 ±0.15
m/m
D : 0.90 typ.
m/m
E : 0.90 typ.
m/m
F1 : 1.30 ref.
m/m
F2 : 3.00 ref.
m/m
G : 0.65 ref.
m/m
H : 2.10 ref.
m/m
I : 1.20 ref.
m/m
J : 1.00 ref.
m/m
R : 1.00 ref.
m/m
F1
F2
Ⅱ﹒SCHEMATIC DIAGRAM：
Ⅲ﹒MATERIALS：
a﹒Core：Ferrite DR core
b﹒Core：Ferrite RI core
c﹒Wire ：Enamelled copper wire ( Class H )
d﹒Adhesive ：Epoxy resin
e﹒Terminal：Ag/Ni/Sn
f﹒Remark：Products comply with RoHS'
requirements
Ⅳ﹒GENERAL SPECIFICATION：
a﹒Temp. rise ：40℃ typ.
b﹒Storage temp.：-40℃ ----+125℃
c﹒Operating temp.：-40℃----+105℃
d﹒Resistance to solder heat：260℃.10 secs.
AR-001A
OR
R
1.24 typ.
( PCB Pattern Suggestion )
Peak Temp：260℃ max.
Max time above 230℃ ：50sec max.
Max time above 200℃ ：70sec max.
Temperature
Rising Area
Preheat Area
+4.0℃ / sec max.
150 ~ 200℃ / 60 ~ 120sec
250
200
Refl ow Area Forced Cooling Area
+2.0 ~ 4.0℃
/ sec max.
-(1.0 ~ 5.0)℃ / sec max.
Peak Temperature:
260℃
50sec max.
230℃
150
70sec max.
100
50
0
50
100
150
200
250
Time ( seconds )