SM4532 Datasheet, PDF (1/6 Pages) ABC Taiwan Electronics Corp – MULTILAYER CHIP BEAD

SPECIFICATION FOR APPROVAL
REF :
PAGE: 1
PROD.
NAME
MULTILAYER CHIP BEAD
ABC'S DWG NO.
ABC'S ITEM NO.
SM□□□□□□□□L□-□□□
Ⅰ﹒CONFIGURATION & DIMENSIONS：
A
D
D
Series
SM4532
SM4516
SM3266
SM3261
SM2029
SM1608
A
4.5±0.2
4.5±0.2
3.2±0.2
3.2±0.2
2.0±0.2
1.6±0.2
B
3.2±0.2
1.6±0.2
1.6±0.2
1.6±0.2
1.2±0.2
0.8±0.2
Ⅱ﹒SCHEMATIC DIAGRAM：
B
C
1.5±0.2
1.6±0.2
1.6±0.2
1.1±0.2
0.9±0.2
0.8±0.2
I
G
I
( PCB Pattrn )
Unit : m/m
D
0.60±0.4
0.60±0.4
0.60±0.4
0.60±0.4
0.50±0.3
0.30±0.2
G
H
I
3.0
3.0
1.5
3.0
1.4
1.5
2.2
1.4
1.1
2.2
1.4
1.1
1.0
1.0
1.0
0.7
0.7
0.7
Ⅲ﹒MATERIALS：
a﹒Body：Ferrite
b﹒Internal conductor：Silver or Ag / Pd
c﹒Terminal electrode：Ag/Ni/Sn
d﹒Remark：Products comply with RoHS' requirements
a
bc
Ⅳ﹒GENERAL SPECIFICATION：
a﹒Storage temp.：-40℃ ---- +105℃
b﹒Operating temp.：-55℃ ---- +125℃
c﹒Terminal Strength：
F
Type
F ( kgf )
time ( sec )
SM4532
1.5
SM4516
1.0
SM3261
SM3266
SM2029
SM1608
1.0
1.0
30±5
0.6
0.5
d﹒Solderability：
Solder : Sn96.5 / Ag3 / Cu0.5
or equivalent
Solder temp. : 260±5℃
Flux : Rosin
Dip time : 4±1 seconds
Peak Temp：260℃ max.
Max time above 230℃ ：50sec max.
Max time above 200℃ ：70sec max.
T empe ratu re
Rising Area
Preheat Area
+4.0℃ / sec max.
150 ~ 200℃ / 60 ~ 120sec
250
200
Reflow Area
+2.0 ~ 4.0℃
/ sec max.
Forced Cooling Area
-(1.0 ~ 5.0)℃ / sec max.
Peak Temperature:
260℃
50sec max.
230℃
150
70sec max.
100
50
0
50
100
150
200
250
Time ( seconds )
AR-001A