SL10051N0DL Datasheet, PDF (1/6 Pages) ABC Taiwan Electronics Corp – WOUND CHIP INDUCTOR

SPECIFICATION FOR APPROVAL
REF :
PAGE: 1
PROD.
NAME
WOUND CHIP INDUCTOR
ABC'S DWG NO.
ABC'S ITEM NO.
SL1005□□□□L□-□□□
CONFIGURATION & DIMENSIONS
D
D
A : 1.00±0.1
m/m
B : 0.50±0.1
m/m
C : 0.50±0.1
m/m
D : 0.20±0.1
m/m
SCHEMATIC DIAGRAM
PCB Pattern
a
c
MATERIALS
a Core Ceramic
b Wire Copper
c Terminal Solder coat over Ni plate (Lead content 100ppm max.)
d Coating Epoxy resin
e Remark Products comply with RoHS'
requirements
GENERAL SPECIFICATION
a Temp rise 15 max
b Rated current Current cause inductance
drop within 10% max
d
Peak Temp 260 max.
Max time above 230 50sec max.
Max time above 200 70sec max.
Temperature
Rising Area
Preheat Area
+4.0 / sec max.
150 ~ 200 / 60 ~ 120sec
250
200
b
Reflow Area
+2.0 ~ 4.0
/ sec max.
Forced Cooling Area
-(1.0 ~ 5.0) / sec max.
Peak Temperature:
260
50sec max.
230
c Storage temp. -40 ----+125
150
d Operating temp. -40 ----+105
100
e Resistance to solder heat 260 .10 secs.
50
70sec max.
AR-001A
0
50
100
150
200
250
Time ( seconds )