SB50091R0ML Datasheet, PDF (1/7 Pages) ABC Taiwan Electronics Corp – SMD POWER INDUCTOR

SPECIFICATION FOR APPROVAL
REF :
PAGE: 1
PROD.
NAME
SMD POWER INDUCTOR
ABC'S DWG NO.
ABC'S ITEM NO.
ŗrCONFIGURATION & DIMENSIONSj
SB5009□□□□L□-□□□
A
4
3
100
1
2
D
D
H IH
A : 5.60 ±0.3 m/m
B : 6.00 ±0.3 m/m
C : 0.95 ±0.1 m/m
D : 1.00 typ. m/m
E : 5.20 typ. m/m
F : 3.20 typ. m/m
G : 0.80 ref. m/m
H : 1.30 ref. m/m
I : 2.00 ref. m/m
J : 6.40 ref.
m/m
K : 4.60 ref. m/m
L : 1.30 ref. m/m
M : 3.80 ref. m/m
F
ŘrSCHEMATIC DIAGRAMj
K
( PCB Pattern Suggestion )
1
3
řrMATERIALSj
arCorejFerrite DR core
brBasejPCB Base FR4
crAdhesive jEpoxy resin
drWirejEnamelled copper wire €class F
erTerminaljCu/Ni/Au
frRemarkjProducts comply with RoHS'
requirements
ŚrGENERAL SPECIFICATIONj
arTemp. rise j40Ċ typ.
brStorage Temp.j-40Ċ ----+125Ċ
crOperating Temp.j-40Ċ----+125Ċ
( Temp. rise Included )
drResistance to solder heat j260Ċ.10 secs.
AE-001A
a
b
100
c
d
Peak Tempj260Ċ max.
Max time above 230Ċ j50sec max.
Max time above 200Ċ j70sec max.
Temperature
Rising Area
Preheat Area
+4.0Ċ / sec max. 150 ~ 200Ċ / 60 ~ 120sec
250
200
Reflow Area Forced Cooling Area
+2.0 ~ 4.0Ċ
/ sec max.
-(1.0 ~ 5.0)Ċ / sec max.
Peak Temperature:
260Ċ
50sec max.
230Ċ
150
70sec max.
100
50
0
50
100
150
200
250
Time ( seconds )