MU1005300YL Datasheet, PDF (1/6 Pages) ABC Taiwan Electronics Corp – MULTILAYER CHIP BEAD

SPECIFICATION FOR APPROVAL
REF :
PAGE: 1
PROD.
NAME
MULTILAYER CHIP BEAD
ABC'S DWG NO.
ABC'S ITEM NO.
MU1005□□□□L□-□□□
Ⅰ﹒CONFIGURATION & DIMENSIONS：
A
D
D
B
Series
MU1005
A
1.00±0.10
B
0.50±0.10
Ⅱ﹒SCHEMATIC DIAGRAM：
C
0.50±0.10
I
G
I
PCB Pattern
Unit : m/m
D
0.20±0.10
G
H
I
0.4
0.4
0.5
Ⅲ﹒MATERIALS：
a﹒Body：Ferrite
b﹒Internal conductor：Silver or Ag / Pd
c﹒Terminal electrode：Ag/Ni/Sn
d﹒Remark：Products comply with RoHS' requirements
a
bc
Ⅳ﹒GENERAL SPECIFICATION：
a﹒Storage temp.：-40 ---- +105℃
b﹒Operating temp.：-55 ---- +125℃
c﹒Terminal strength：
F
Type
F ( kgf ) Time ( sec )
MU1005
0.3
30±5
d﹒Solderability：
Solder : Sn96.5 / Ag3 / Cu0.5
or equivalent
Solder temp. : 260±5℃
Flux : Rosin
Dip time : 4±1 seconds
Peak Temp：260℃ max.
M ax tim e above 230℃ ：50sec max.
M ax tim e above 200℃ ：70sec max.
Tempe ratu re
Rising Area
Preheat Area
+4.0℃ / sec max.
150 ~ 200℃ / 60 ~ 120sec
250
200
150
100
50
Reflow Area
+2.0 ~ 4.0℃
/ sec max.
Forced Cooling Area
-(1.0 ~ 5.0)℃ / sec max.
P eak Temperature:
260℃
50s ec max.
230℃
70sec max.
0
50
100
150
200
250
Tim e ( seconds )
AR-001A