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MS326147NML Datasheet, PDF (1/6 Pages) ABC Taiwan Electronics Corp – MULTILAYER CHIP INDUCTOR | |||
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SPECIFICATION FOR APPROVAL
REF :
PAGE: 1
PROD.
ABC'S DWG NO.
MULTILAYER CHIP INDUCTOR
NAME
ABC'S ITEM NO.
MS3261â¡â¡â¡â¡Lâ¡-â¡â¡â¡
â
ï¹CONFIGURATION & DIMENSIONSï¼
A
D
D
Series
MS3261
A
3.20±0.20
B
1.60±0.20
â
¡ï¹SCHEMATIC DIAGRAMï¼
B
C
1.10±0.20
I
G
I
( PCB Pattern )
Unit : m/m
D
G
H
I
0.60±0.40
2.2
1.4
1.1
â
¢ï¹MATERIALSï¼
aï¹Bodyï¼Ferrite
bï¹Internal conductorï¼Silver or Ag / Pd
cï¹Terminalï¼Cu/Sn
dï¹Remarkï¼Products comply with RoHS' requirements
a
bc
â
£ï¹GENERAL SPECIFICATIONï¼
aï¹Storage temp.ï¼-40â---- +105â
bï¹Operating temp.ï¼-55â ---- +125â
cï¹Terminal storengthï¼
F
Type
F ( kgf )
time ( sec )
MS3261
1.0
30±5
dï¹Solderabilityï¼
Solder : Sn96.5 / Ag3 / Cu0.5
or equivalent
Solder temp. : 260±5â
Flux : Rosin
Dip time : 4±1 seconds
AR-001A
Peak Tempï¼260â max.
Max time above 230â ï¼50sec max.
Max time above 200â ï¼70sec max.
Temperatu re
Rising Area
Preheat Area
+4.0â / sec max.
150 ~ 200â / 60 ~ 120sec
250
200
150
100
50
Reflow Area
+2.0 ~ 4.0â
/ sec max.
Forced Coo ling Area
-(1 .0 ~ 5.0)â / sec max.
Peak Temperature:
2 60â
50sec max.
230â
70sec max.
0
50
100
150
200
250
Time ( seconds )
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