MS202947NML Datasheet, PDF (1/6 Pages) ABC Taiwan Electronics Corp – MULTILAYER CHIP INDUCTOR

SPECIFICATION FOR APPROVAL
REF : 20090811-A
PAGE: 1
PROD.
ABC'S DWG NO.
MULTILAYER CHIP INDUCTOR
NAME
ABC'S ITEM NO.
MS20□□□□□□L□-□□□
Ⅰ﹒CONFIGURATION & DIMENSIONS：
A
D
D
B
Series
MS2029
MS2022
A
2.00±0.20
2.00±0.20
B
1.20±0.20
1.20±0.20
C
0.90±0.20
1.20±0.20
Ⅱ﹒SCHEMATIC DIAGRAM：
I
G
I
( PCB Pattern )
Unit : m/m
D
G
H
I
0.50±0.30
1.0
1.0
1.0
0.50±0.30
1.0
1.0
1.0
Ⅲ﹒MATERIALS：
a﹒Body：Ferrite
b﹒Internal conductor：Silver or Ag / Pd
c﹒Terminal：Cu/Sn
d﹒Remark：Products comply with RoHS' requirements
a
bc
Ⅳ﹒GENERAL SPECIFICATION：
a﹒Storage temp.：-40 ---- +105℃
b﹒Operating temp.：-55 ---- +125℃
c﹒Terminal Strength：
F
Type
F ( kgf ) time ( sec )
MS2022
0.8
MS2029
0.6
30±5
d﹒Solderability：
Solder : Sn96.5 / Ag3 / Cu0.5
or equivalent
Solder temp. : 260±5℃
Flux : Rosin
Dip time : 4±1 seconds
Peak Temp：260℃ max.
Max time above 230℃ ：50sec max.
Max time above 200℃ ：70sec max.
Tempera tu re
Rising Area
Preheat Area
+4.0℃ / sec max.
150 ~ 200℃ / 60 ~ 120sec
250
200
Reflow Area
+2.0 ~ 4.0℃
/ sec max.
Forced Cooling Area
-(1.0 ~ 5.0)℃ / sec max.
Peak Temperature:
260℃
50sec max.
230℃
150
70sec max.
100
50
0
50
100
150
200
250
Time ( seconds )
AR-001A