MS160847NML Datasheet, PDF (1/6 Pages) ABC Taiwan Electronics Corp – MULTILAYER CHIP INDUCTOR

SPECIFICATION FOR APPROVAL
REF :
PAGE: 1
PROD.
ABC'S DWG NO.
MULTILAYER CHIP INDUCTOR
NAME
ABC'S ITEM NO.
MS1608□□□□L□-□□□
Ⅰ﹒CONFIGURATION & DIMENSIONS：
A
D
D
Series
MS1608
A
1.60±0.20
B
B
0.80±0.20
C
0.80±0.20
I
G
I
(PCB Pattern)
Unit : m/m
D
G
H
I
0.30±0.20
0.7
0.7
0.7
Ⅱ﹒SCHEMATIC DIAGRAM：
Ⅲ﹒MATERIALS：
a﹒Body：Ferrite
b﹒Internal conductor：Silver or Ag / Pd
c﹒Terminal：Cu/Sn
d﹒Remark：Products comply with RoHS' requirements
a
bc
Ⅳ﹒GENERAL SPECIFICATION：
a﹒Storage temp.：-40℃ ---- +105℃
b﹒Operating temp.：-25℃ ---- +85℃
c﹒Terminal strngth：
F
Type
F ( kgf ) time ( sec )
MS1608
0.5
30±5
d﹒Solderability：
Solder : Sn96.5 / Ag3 / Cu0.5
or equivalent
Solder temp. : 260±5℃
Flux : Rosin
Dip time : 4±1 seconds
AR-001A
Peak Temp：260℃ max.
Max time above 230℃ ：50sec max.
Max time above 200℃ ：70sec max.
T empera tu re
Rising Area
Preheat Area
+4.0℃ / sec max.
150 ~ 200℃ / 60 ~ 120sec
250
200
150
100
50
Reflow Area
+2.0 ~ 4.0℃
/ sec max.
Forced Cooling Area
-(1.0 ~ 5.0)℃ / sec max.
Peak Temperature:
260℃
50s ec max.
230℃
70sec max.
0
50
100
150
200
250
Time ( seconds )