MH16081N0DL Datasheet, PDF (1/5 Pages) ABC Taiwan Electronics Corp – MULTILAYER CHIP INDUCTOR

SPECIFICATION FOR APPROVAL
REF :
PAGE: 1
PROD.
NAME
ABC'S DWG NO.
MULTILAYER CHIP INDUCTOR
ABC'S ITEM NO.
MH1608□□□□L□-□□□
CONFIGURATION & DIMENSIONS
A
D
A : 1.60±0.15
m/m
B : 0.80±0.15
m/m
C : 0.80±0.15
m/m
D : 0.30±0.20
m/m
SCHEMATIC DIAGRAM
FEATURES
a Monolithic structure ensuring high performance and reliability.
b High frequency applications up to 6GHz.
c Terminal Ag/Cu/Ni/Sn
d Remark Products comply with RoHS' requirements
APPLICATIONS
a RF modules for telecommunication systems including
GSM, PCS,DECT,WLAN,Bluetooth,etc.
GENERAL SPECIFICATION
a Storage temp. -55 ---- +125
b Operating temp. -55 ---- +125
c Solderability Preheat 150 . 60 sec
Solder H63A
Solder temp. 230±5
Flux Rosin
Dip time 4±1 sec
Peak Temp 260 max.
Max time above 230 50sec max.
Max time above 200 70sec max.
Temperature
Rising Area
Preheat Area
+4.0 / sec max.
150 ~ 200 / 60 ~ 120sec
250
200
150
100
50
Reflow Area
+2.0 ~ 4.0
/ sec max.
Forced Cooling Area
-(1.0 ~ 5.0) / sec max.
Peak Temperature:
260
50sec max.
230
70sec max.
AR-001A
0
50
100
150
200
250
Time ( seconds )