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MH10051N0DL Datasheet, PDF (1/6 Pages) ABC Taiwan Electronics Corp – MULTILAYER CHIP INDUCTOR | |||
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SPECIFICATION FOR APPROVAL
REF :
PAGE: 1
PROD.
ABC'S DWG NO.
MULTILAYER CHIP INDUCTOR
NAME
ABC'S ITEM NO.
MH1005â¡â¡â¡â¡Lâ¡-â¡â¡â¡
â
ï¹CONFIGURATION & DIMENSIONSï¼
A
D
A : 1.00±0.10
m/m
B : 0.50±0.10
m/m
C : 0.50±0.10
m/m
D : 0.23±0.10
m/m
â
¡ï¹SCHEMATIC DIAGRAMï¼
â
¢ï¹FEATURESï¼
aï¹Monolithic structure ensuring high performance and reliability.
bï¹High frequency applications up to 6GHz.
cï¹Terminalï¼Ag/Cu/Ni/Sn
dï¹Remarkï¼Products comply with RoHS' requirements
â
£ï¹APPLICATIONSï¼
aï¹RF modules for telecommunication systems including
GSM, PCS,DECT,WLAN,Bluetooth,etc.
â
¤ï¹GENERAL SPECIFICATIONï¼
aï¹Storage temp.ï¼-55â---- +125â
bï¹Operating temp.ï¼-55â ---- +125â
cï¹Solderabilityï¼Preheat 150â. 60 sec
Solderï¼H63A
Solder temp.ï¼230±5â
Fluxï¼Rosin
Dip timeï¼4±1 sec
Peak Tempï¼260â max.
Max time above 230â ï¼50sec max.
Max time above 200â ï¼70sec max.
T empe ratu re
Rising Area
Preheat Area
+4.0â / sec max.
150 ~ 200â / 60 ~ 120sec
250
200
Reflow Area
+2.0 ~ 4.0â
/ sec max.
Forced Cooling Area
-(1.0 ~ 5.0)â / sec max.
Peak Temperature:
260â
50sec max.
230â
150
70sec max.
100
50
0
50
100
150
200
250
Time ( seconds )
AR-001A
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