MH10051N0D2 Datasheet, PDF (1/6 Pages) ABC Taiwan Electronics Corp – MULTILAYER CHIP INDUCTOR

SPECIFICATION FOR APPROVAL
REF :
PAGE: 1
PROD.
ABC'S DWG NO.
MULTILAYER CHIP INDUCTOR
NAME
ABC'S ITEM NO.
MH1005□□□□2□-□□□
Ⅰ﹒CONFIGURATION & DIMENSIONS：
A
D
A : 1.00±0.10 m/m
B : 0.50±0.10
m/m
C : 0.50±0.10
m/m
D : 0.23±0.10 m/m
Ⅱ﹒SCHEMATIC DIAGRAM：
Ⅲ﹒FEATURES：
a﹒Monolithic structure ensuring high performance and reliability.
b﹒High frequency applications up to 6GHz.
c﹒Terminal：Ag/Cu/Ni/Sn
d﹒Remark：Products comply with RoHS' requirements
Ⅳ﹒APPLICATIONS：
a﹒RF modules for telecommunication systems including
GSM, PCS,DECT,WLAN,Bluetooth,etc.
Ⅴ﹒GENERAL SPECIFICATION：
a﹒Storage temp.：-55℃---- +125℃
b﹒Operating temp.：-55℃ ---- +125℃
c﹒Solderability：Preheat 150℃. 60 sec
Solder：H63A
Solder temp.：230±5℃
Flux：Rosin
Dip time：4±1 sec
Peak Temp：260℃ max.
Max time above 230℃ ：50sec max.
Max time above 200℃ ：70sec max.
Tempe ra tu re
Rising Area
Preheat Area
+4.0℃ / sec max.
150 ~ 200℃ / 60 ~ 120sec
250
200
Reflow Area
+2.0 ~ 4.0℃
/ sec max.
Forced Cooling Area
-(1.0 ~ 5.0)℃ / sec max.
Peak Temperature:
2 60℃
50sec max.
230℃
150
70sec max.
100
50
0
50
100
150
200
250
Time ( seconds )
AR-001A