HP1206R10M2 Datasheet, PDF (1/6 Pages) ABC Taiwan Electronics Corp – SHIELDED SMD POWER INDUCTOR

SPECIFICATION FOR APPROVAL
REF : 20090825-B
PAGE: 1
PROD.
NAME
SHIELDED SMD
ABC'S DWG No.
POWER INDUCTOR ABC'S ITEM No.
HP1206□□□□2□-□□□
Ⅰ﹒MECHANICAL DIMENSIONS：
Marking
( Whi te )
Inductance code
E
A
A : 13.5 ± 0.4 m/m
B : 12.5 ± 0.3 m/m
C : 4.00 ± 0.3 m/m
D : 6.50 max. m/m
E : 2.00 ± 0.5 m/m
F : 5.00 typ. m/m
G : 8.00 typ. m/m
H : 14.0 typ. m/m
G
H
( PCB Pattern )
Ⅱ﹒SCHEMATIC DIAGRAM：
1
2
Ⅲ﹒MATERIALS LIST：
a﹒Core：Iron powder
b﹒Wire：Enamelled copper wire
c﹒Cilp：Cu / Ni /Sn
d﹒Remark：Products comply with RoHS'
requirements
Ⅳ﹒GENERAL SPECIFICATION：
a﹒Storage temp.：-55℃~ +125℃
b﹒Operating temp .：-55℃~ +125℃
( Temp. rise included )
c﹒Resistance to solder heat：260℃. 10 secs.
AR-001A
a
b
c
Peak Temp：260℃ max.
Max time above 230℃ ：50sec max.
Max time above 200℃ ：70sec max.
T empera ture
Rising Area
Pre he at Area
+4.0℃ / sec max.
150 ~ 200℃ / 60~120sec
250
200
Reflow Area Force d Cooling Area
+2.0 ~ 4.0℃
/ se c ma x.
-(1.0 ~ 5.0)℃ /sec max.
Pea k Te mperature:
2 60℃
5 0sec max.
230℃
150
100
7 0sec max.
50
0
50
100
150
200
250
Time ( seconds )