CM252010NJ3 Datasheet, PDF (1/8 Pages) ABC Taiwan Electronics Corp – WOUND CHIP INDUCTOR

SPECIFICATION FOR APPROVAL
REF : 20080718-A
PAGE: 1
PROD.
NAME
WOUND CHIP INDUCTOR
ABC'S DWG NO.
ABC'S ITEM NO.
Ⅰ﹒CONFIGURATION & DIMENSIONS：
C M2520 □□□□3 □-□□□
A
Not Marking
A : 2.5±0.2
m/m
B : 2.0±0.1
m/m
C : 1.8±0.1
m/m
E : 1.4±0.1
m/m
F : 0.40
m/m
F
F
E
Ⅱ﹒SCHEMATIC DIAGRAM：
0.9 1.5 0.9
（ PCB Pattern ）
d
Ⅲ ﹒MATER IALS：
a﹒Core：Ferrite DR core
b﹒Wire ：Enamelled copper wire ( class F )
c﹒Terminal：Cu/Sn
d﹒Encapsulate：Epoxy novolac molding compound
e﹒Remark：Products comply with RoHS' requirements
a
c
b
Ⅳ﹒GENERAL SPECIFICATION：
a﹒Temp. rise ：20℃ max.
b﹒Ambient temp.：80℃ max.
c﹒Storage temp.：-40℃ ----+100℃
d﹒Operating temp.：-40℃----+85℃
e﹒Terminal strength：0.5 kg min.
f﹒Rated current：Current cause
inductance drop within 10%
g﹒Resistance to solder heat：260℃.10 secs.
h﹒Resistance to solvent：Per MIL-STD-202F
AR-0 01A
Peak Temp：245 ℃ max.
M ax time above 225℃ ：3 0sec max.
M ax time above 200℃ ：5 0sec max.
Temp erature
R is in g Area
P reh eat Area
2 ~ 4 ℃ / sec
1 50 ~ 180 ℃ / 90 ~ 150 sec
250
200
150
100
50
R eflo w Area
2 ~ 4 ℃ / sec
F orced Co olin g Area
3 ~ 5 ℃ / sec
2 40 ±5℃
10sec
30sec max.
( 2 0~3 0sec )
0
50
100
150
200
250
Time ( seconds )