CB30111R0ML Datasheet, PDF (1/6 Pages) ABC Taiwan Electronics Corp – SMD POWER INDUCTOR

SPECIFICATION FOR APPROVAL
REF : 20070123-A
PAGE: 1
PROD.
NAME
SMD POWER INDUCTOR
ABC'S DWG NO.
ABC'S ITEM NO.
CB3011□□□□L□-□□□
Ⅰ﹒CONFIGURATION & DIMENSIONS：
A
4R7
A : 3.60±0.15
B : 3.90 max.
C : 1.10±0.10
D : 1.10±0.30
E : 0.80±0.20
F : 1.60 ref.
G : 4.00 ref.
H : 1.00 ref.
m/m
m/m
m/m
m/m
m/m
m/m
m/m
m/m
E
G
Ⅱ﹒SCHEMATIC DIAGRAM：
H
(PCB Pattern Suggestion)
Ⅲ﹒MATERIALS：
a﹒Core：Ferrite core
b﹒Wire：Enamelled copper wire
c﹒Base：Cu/Ag(1.0um)
d﹒Adhesive：Epoxy resin
e﹒Remark：Products comply with RoHS'
requirements
Ⅳ﹒GENERAL SPECIFICATION：
a﹒Temp. rise ：40℃ typ.
b﹒Storage temp.：-40℃ ----+120℃
c﹒Operating temp.：-40℃----+125℃
(included Temp. rise)
d﹒Resistance to solder heat：260℃.10 secs.
AR-001A
b
a
d
c
Peak Temp：260℃ max.
Max time above 230℃ ：50sec max.
Max time above 200℃ ：70sec max.
Temperature
Rising Area
Preheat Area
+4.0℃ / sec max.
150 ~ 200℃ / 60 ~ 120sec
250
200
Reflow Area Forced Cooling Area
+2.0 ~ 4.0℃ _{-(1.0 ~ 5.0)℃ / sec max.}
Peak Temperature:
260℃
50sec max.
230℃
150
70sec max.
100
50
0
50
100
150
200
250
Time ( seconds )