61085 Datasheet, PDF (2/2 Pages) Tyco Electronics – SOCKET, 156 MATE-N-LOK

DATASHEET
EXTRUSION PROFILE 61085
THERMAL DATA
Natural Convection: 1.52 based on 70 C temp rise above ambient.
Thermal resistance is calculated based on a single 1" (25.4mm) square heat source centered on the heat sink. If you
have distributed loads, then you can expect 10% better performance in natural convection and 20% better
performance in forced convection.
Natural Convection
Heat Sink Temperature Rise
Above Ambient
Heat Sink
Thermal Resistance
25.0
7.00
18.8
5.25
12.5
3.50
6.2
1.75
0.0
1.0
3.0
5.0
7.0
9.0
Power Dissipated (W)
Forced Convection
Heat Sink Temperature Rise
Above Ambient (10W Dissipated)
Air Flow (m/s)
1.0
2.0
3.0
4.1
5.1
15.0
11.2
7.5
3.8
0.00
1.0
3.0
5.0
7.0
9.0
Power Dissipated (W)
1.0
1.50
1.12
0.75
0.38
Heat Sink
Thermal Resistance
Air Flow (m/s)
2.0
3.0
4.1
5.1
0.0
200
400
600
800
Air Flow (LFM)
1000
0.00
200
400
600
800
Air Flow (LFM)
1000
USA: 1.855.322.2843
EUROPE: 39.051.764002
ASIA: 86.21.6115.2000 x8122
Extrusion Profile 61085
www.aavid.com
November 2016 A02