372924M02000 Datasheet, PDF (1/3 Pages) Aavid, Thermal Division of Boyd Corporation – Push Pin Attachment Method

Standard Products Found
Page 1 of 3
Push Pin Attachment Method
Part Number: 372924M02000
(Vis Number: 028086)
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BGA Surface Interface Heat Sink Finish Part Class
All
None Green Anodize
A
Features and Benefits
• Configurations are available for a wide range of BGA package sizes
• All Heat Sinks utilize industry standard hole patterns
• Plastic push pins are standard for 1.5mm pc board and 2.5mm
thick BGA packages. Consult Aavid Thermalloy for versions
available with brass push pins for more rugged applications or
thicker devices
• Minimal diameter holes are necessary for mounting to PC Board
(see PCB Hole Pattern)
• Each Heat Sink utilizes a phase change pad as the interface for
optimal performance, unless otherwise noted
Width
Length
Height
Fin Thickness
Across Width
Fin Thickness
Across Length
Base
Thickness
# of
across
fins
width
# of fins
across length
37.4mm 37.4mm 6mm 1.4mm
1.5mm
1.3mm
9
9
Mechanical Outline Drawing
Unless otherwise shown, tolerances are ±0.38(±.015)
http://www.aavidthermalloy.com/bin/bga_disp_print.pl?partnum=028086&attach=&size=... 2/25/2003