341600F00000G Datasheet, PDF (1/2 Pages) Aavid, Thermal Division of Boyd Corporation – Product Process Change

Thin-Fin™ Heat Sinks
For computers and custom applications
LOW PROFILE COPPER HEAT SINKS
IDEAL FOR PCI AND AGP CHIP SETS
When space is at a premium, Aavid’s Thin-fin heat sinks
reduce package case temperature by as much as 20ºC.
These flexible, copper spreaders attach to the electronic
package using pre-applied adhesive, providing an off-the-
shelf solution for PCI and AGP chip sets. A laminated
dielectric coating prevents shorting, making the Thin-Fin
ideal for BGA devices and multimedia applications.
FEATURES:
• Offer significant cooling with limited headroom
• Pre-applied adhesive for rapid assembly
• Dielectric coating prevents shorting
• Fits many IC package styles
APPLICATIONS:
• Graphics Processors
• FPGA’s
• Embedded Processors
• DSP’s
• Any device using a BGA, PGA,
or a QFP package
ORDERING INFORMATION:
Part Number
“A”
“B”
“C”
341600F00000G 50.8 (2.00) 12.7 (0.50) 12.7 (0.50)
341700F00000G 76.2 (3.00) 12.7 (0.50) 12.7 (0.50)
341800F00000G 76.2 (3.00) 19.1 (0.75) 19.1 (0.75)
341900F00000G* 76.2 (3.00) 25.4 (1.00) 25.4 (1.00)
342000F00000G 101.6 (4.00) 25.4 (1.00) 25.4 (1.00)
342100F00000G 101.6 (4.00) 38.1 (1.50) 38.1 (1.50)
* Recommended for use in cooling microprocessor chip sets, such as PCI and AGP.
Notes: Dimensions are in mm (inches) Contact our Applications Engineering Department
for custom configurations
A
B
0.0015 in. Black PVF
0.007 in. RA Copper
0.0015 in. Black PVF
C
0.002 in. Thermattach PSA
Folding Scores
Release Liner
FOR MORE INFORMATION, VISIT OUR WEB SITE: WWW.AAVIDTHERMALLOY.COM
TEL: [phone]