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AP6922GMT-HF_14 Datasheet, PDF (3/7 Pages) Advanced Power Electronics Corp. – Simple Drive Requirement
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AP6922GMT-HF
CH-2 Electrical Characteristics@Tj=25oC(unless otherwise specified)
Symbol
Parameter
Test Conditions
Min. Typ. Max. Units
BVDSS
RDS(ON)
Drain-Source Breakdown Voltage
Static Drain-Source On-Resistance2
VGS=0V, ID=250uA
VGS=10V, ID=20A
VGS=4.5V, ID=12A
30 -
-
V
- 2.9 3.8 mΩ
-
4 5.2 mΩ
VGS(th)
Gate Threshold Voltage
VDS=VGS, ID=250uA
1 1.5 3 V
gfs
Forward Transconductance
VDS=10V, ID=20A
IDSS
Drain-Source Leakage Current
VDS=24V, VGS=0V
IGSS
Gate-Source Leakage
VGS=+12V, VDS=0V
Qg
Total Gate Charge
ID=20A
Qgs
Gate-Source Charge
VDS=15V
Qgd
Gate-Drain ("Miller") Charge
VGS=4.5V
td(on)
Turn-on Delay Time
VDS=15V
tr
Rise Time
ID=1A
td(off)
Turn-off Delay Time
RG=3.3Ω
tf
Fall Time
VGS=10V
Ciss
Input Capacitance
VGS=0V
Coss
Output Capacitance
VDS=15V
Crss
Reverse Transfer Capacitance
f=1.0MHz
Rg
Gate Resistance
f=1.0MHz
- 60 -
S
-
- 100 uA
-
- +100 nA
- 36 57 nC
- 10 - nC
- 20 - nC
- 15 - ns
- 10 - ns
- 60 - ns
- 25 - ns
- 3900 6240 pF
- 500 - pF
- 400 - pF
- 1.6 3.2 Ω
Source-Drain Diode
Symbol
VSD
trr
Qrr
Parameter
Test Conditions
Diode+Schottky Forward On Voltage2 IS=1A, VGS=0V
Body Diode+Schottky Reverse Recovery Time IS=10A, VGS=0V,
Body Diode+Schottky Reverse Recovery Charge dI/dt=100A/µs
Notes:
1.Pulse width limited by Max. junction temperature.
2.Pulse test
3.Surface mounted on 1 in2 copper pad of FR4 board, t <10sec.
4.Surface mounted on 1 in2 copper pad of FR4 board, on steady-state
Min. Typ. Max. Units
- 0.48 0.5 V
- 25 - ns
- 15 - nC
THIS PRODUCT IS SENSITIVE TO ELECTROSTATIC DISCHARGE, PLEASE HANDLE WITH CAUTION.
USE OF THIS PRODUCT AS A CRITICAL COMPONENT IN LIFE SUPPORT OR OTHER SIMILAR SYSTEMS IS NOT AUTHORIZED.
APEC DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED
HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
APEC RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN.
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