8300 Datasheet, PDF (12/16 Pages) 3M Electronics – Static Dissipative Rigid Worksurface 8300 Series

18.0 Troubleshooting Guide
Symptom
Cracking
Poor Postforming
Surface changes
Shrinkage
Chipping
Blistering
Bumps
Problem Causes
Recommendations
Moisture differences between
substrate and laminate
Condition properly prior to lamination
Pre-condition laminate to match end-
use conditions
Poor adhesive bond
Follow manufacturer’s
recommendations closely
For highest bond, use thermoset
adhesives
Substrate flexing
Use thicker substrate
Support substrate with backer
Stress points
Radius inside corners of openings to
0.125 in. (3.2 mm) minimum
Cracking at bend point
Backside of laminate too cool
Heat to 325°F on backside, 350°-
375°F on front
Ensure that proper temperature has
been reached prior to bending
Do not force bending
Heating too slowly; laminate cures Laminate must reach optimum
before bending is completed
bending temperature within 30-60 sec
Laminate too dry
Pre-condition laminate properly, add
moisture
Substrate uneven
Ensure that substrate is smooth,
straight, and of even curvature
Substrate should be larger than
laminate
Discoloration
Due to sunlight
Laminate not intended for outdoor use
Keep laminate away from direct
sunlight
Due to chemicals
Avoid prolonged exposure to bleaches,
acids, alkalis
Due to heat
Remove/insulate heat source
Dents/depressions due to substrate
imperfections
Use higher-density, thicker, or
smoother substrate
Cover at least 80% of the bond
surfaces with adhesive
Improper conditioning
Pre-condition materials properly
Adhesive failure
Increase amount of adhesive and
pressure
Improper tools
Use carbide-tipped blades with teeth
then cut into the top surface of the
laminate
Slow cutting speed
Increase cutting speed
Unsupported laminate
Support laminate sheet at the cutting
point
Excessive heat
Remove/insulate heat source
Foreign particles trapped between
laminate and substrate
Clean surfaces thoroughly before
laminating
Adhesive lumps between laminate and Heat the surface and apply pressure
substrate
(roller, wood block and hammer, etc.)
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