9631032000ARTP Datasheet, PDF (1/5 Pages) 3M Electronics – 3M™ Through-Board Socket

3M^™ Through-Board Socket
2.54 mm, Single Row, Dual Entry, Surface Mount
963 Series
• High temperature dielectric
• “No lead” reflow solder compatible
• Single row design, 3–30 pins
• Mates with pin headers for board stacking
applications
• Dual entry design allows mating from top side or
bottom side through the printed circuit board
• See Regulatory Information Appendix for
chemical compliance information
Date Modified: October 16, 2008
Physical
Insulation
Material: High Temperature Thermoplastic
Flammability:
UL 94V-0
Color:
Black
Contact
Material:
Copper Alloy
Plating
Underplating: 1.25–2.5 Ʌm [50–100 Ʌ’’] Nickel
Wiping Area: 0.25 Ʌm [10 Ʌ’’] Gold
Solder Tail Area: 1–3 Ʌm [40–118 Ʌ’’] Matte Tin
TS-2190-C
Sheet 1 of 2
Electrical
Current Rating: 2 A
Insulation Resistance: > 5 x 10 ⁸ Ohm at 100 V
DC
Withstanding Voltage: 1000 V
DC
Environmental
Temperature
Range: -25 °C to +105 °C
Processing Temperature: max. 260 °C (Profile per J-STD-020C)
Moisture Sensitivity Level: 1 (per J-STD-020C)
UL File No.: E68080
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