9601026202AR Datasheet, PDF (1/5 Pages) 3M Electronics – 3M™ Boardmount Socket

3M^™ Boardmount Socket
2.54 mm and 2.54 mm x 2.54 mm, Straight, Solder Tail
960 Series
• High temperature dielectric
• “No lead” wave and reflow solder compatible
• Single- and dual row design, 2–36 pins or 4–72 pins
• Housing height options: 8.5 mm and 7.1 mm
• Mates with pin-strip header products
• See Regulatory Information Appendix for ­chemical
compliance information
Date Modified: February 14, 2008
Physical
Insulation
Material: High Temperature Thermo­plastic
Flammability: UL 94V-0
Color: Black
Contact
Material: Copper Alloy
Plating
Underplating: 1.25–2.5 µm [50–100 µ’’] Nickel
Wiping Area: 0.25 µm [10 µ’’] Gold
Solder Tail Area: 1–3 µm [40–118 µ’’] Matte Tin
TS-2187-A
Sheet 1 of 2
Electrical
Current Rating: 2 A
Insulation Resistance: > 5 x 10⁸ Ohm at 100 V_DC
Withstanding Voltage: 1000 V_DC
Environmental
Temperature Range: -25 °C to +105 °C
Processing Temperature: max. 260 °C (Profile per J-STD-020C)
Moisture Sensitivity Level: 1 (per J-STD-020C)
Interconnect Solutions
http://www.3M.com/interconnects/
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