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950408-5002-AR Datasheet, PDF (1/4 Pages) 3M Electronics – 3M™ Boardmount Socket
3M™ Boardmount Socket
2 mm and 2 mm x 2 mm Right Angle, Solder Tail
950 Series
• Optimizes use of PC board space
• High temperature dielectric
• “No lead” wave and reflow solder compatible
• S ingle- and dual row design, 3–40 pins or
4–80 pins
• Mates with pin-strip header products
• S ee the Regulatory Information Appendix (RIA) in the
“RoHS compliance” section of www.3M.com/inter-
connects for compliance information
Date Modified: April 24, 2012
Physical
Insulation
Material: High Temperature Thermo­plastic
Flammability: UL 94V-0
Color: Black
Contact
Material: Copper Alloy
Plating
Underplating: 1.25–2.5 µm [100 µ’’] Nickel
Wiping Area: 0.25 µm [10 µ’’] Gold
Solder Tail Area: 1–3 µm [40–118 µ’’] Matte Tin
Electrical
Current Rating: 1 A
Insulation Resistance: > 5 x 108 Ohm at 100 VDC
Withstanding Voltage: 1000 VDC
Transition Resistance: ≤ 20 mOhm
Environmental
Temperature Range: -25 °C to +105 °C
Processing Temperature: max. 260 °C (Profile per J-STD-020C)
Moisture Sensitivity Level: 1 (per J-STD-020C)
TS-2164-D
Sheet 1 of 2
UL File No.: E68080
Interconnect Solutions
http://www.3M.com/interconnects/
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